Heat conduction filler as its name implies is added in the matrix material used to increase the thermal conductivity of the material filler, commonly used heat conduction filler alumina, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, etc.Among them, especially micron alumina, silicon powder as the main body.The morphology of alumina has great influence on the thermal conductivity of alumina.Spherical alumina ultrafine powder is a micron powder, with high thermal conductivity, high insulation, high hardness, high temperature resistance, abrasion resistance, corrosion resistance, and other characteristics;High purity, good shape, good stability, narrow particle size distribution, with a small amount of filling to obtain higher thermal conductivity.Introduction to thermal conductive alumina: thermal conductive alumina is a white powder crystal generated under high temperature. There are many crystalline powders of alumina, but alumina used for thermal conduction includes spherical alumina (zf-kq series), spherical alumina (zf-kk series), composite alumina (zf-kqm, KCM series), etc.The thermal conductive alumina must have the characteristics of narrow particle size distribution, good particle size stability, high thermal conductivity K value and high number of filling fractions after coupling modification.In general, the average particle size of heat-conducting alumina can be controlled at about 5um, and thermal conductivity can reach between 3-10w /mk according to different filling amount.
Post time: Oct-11-2019